KST-SEMI10

Semi-Automatic Taping Machine

The KST-SEMI10 is a high-performance, cost-effective solution for the back-end packaging of electronic components. Designed with a “Human-Machine Collaboration” philosophy, the system pairs manual component placement with automated sealing and reeling. It delivers industrial-grade packaging quality with a significantly lower capital investment—making it the definitive choice for high-mix/low-volume production, rapid prototyping, and sample kitting.

Operational Workflow

Manual Placement → Trigger (Foot Pedal/Button) → Auto-Feed → Vision Alignment (Optional) → Automated Sealing → Finished Reel Output

The ergonomically optimized workstation allows operators to maintain high throughput with minimal fatigue. Once triggered, the machine executes a synchronized taping cycle, ensuring a seamless interface between human dexterity and fully automated enclosure.

Core Advantages

High ROI Investment: Achieve up to 80% of the efficiency of fully automated lines at only 1/3 to 1/2 of the cost.
Rapid Changeover: Adaptive to various component geometries via quick-change fixtures.
Zero Learning Curve: Intuitive controls eliminate the need for complex programming, allowing operators to become proficient with minimal training.
Automated Sealing Precision: Features an automated sealing system to ensure consistent peel strength and SMT-ready reliability.
Vision-Ready (Optional): Can be integrated with CCD-assisted alignment to provide real-time visual feedback for high-precision placement.
Compact Footprint: A space-saving, energy-efficient design that integrates easily into diverse factory layouts or laboratory environments.

Applications

Ideal Use Cases

HMLV Production: Back-end packaging for high-mix, small-to-medium batch lines.
R&D & Prototyping: Professional sample preparation and pilot production.
Specialized Components: Custom packaging for odd-form or sensitive components.

Industries

Electronic Component Distributors: For value-added sample packaging and re-reeling.
EMS & SME Manufacturers: Cost-effective scaling for growing production needs.
Laboratories & Research Institutes: Precision packaging for innovative developments.

Typical Processable Products

Semiconductors: ICs (SOP, QFN, BGA), LED chips, and discrete devices.
Passives: Odd-form inductors, large capacitors, and specialized resistors.
Interconnects: USB ports, pin headers, and various SMD connectors.
Electromechanical: Micro-switches, sensors, and relays.

Loading Method: Manual placement

Throughput: Dependent on operator loading speed

Dimensions(L × W × H): 1467mm × 320mm × 485mm

Machine Weight: Approx. 85 kg

Power Supply: Single-phase AC 220V / 50Hz

Air Supply: 0.3 – 0.6 MPa

The machine is available in configurable options to suit your production needs.
Reach out today to discuss your requirements and get a solution tailored for your line.

Get in touch with us

Have a question about our taping machines or a specific application?

Send us a message — our team will respond within 1–2 hours during working hours.

To help us assist you efficiently, you may include:
– Component type (e.g. IC, SMD)
– Tape width / reel specifications
– Required output or speed
– Any inspection requirements

A brief description is perfectly sufficient to get started.