Automatic Integrated Laser Marking, Vision Inspection and Taping Machine

Automated Workflow

1. Versatile Feeding: Supports multiple input methods, including vibration bowls (for bulk parts), Tray feeders, or Tube feeders, ensuring smooth and continuous material flow.

2. Laser Marking: Equipped with high-performance laser engines to perform non-contact, permanent etching of batch codes, QR codes, and logos based on real-time data.

3. Vision Inspection (optional):

• Marking Verification: Validates character accuracy, alignment, and legibility (OCR/OCV).
• Cosmetic Inspection: Automatically detects surface defects such as scratches, chipping, or molding flash.
• Polarity Check: Ensures 100% correct orientation before packaging.

4. Intelligent Sorting: Real-time feedback loops trigger the precision rejection of NG (No-Good) parts, ensuring a closed-loop data cycle.

5. High-Speed Taping: Qualified components are accurately placed into carrier tapes, followed by precision sealing (Heat or Pressure seal) and automated reel winding.

Key Features

• Permanent Traceability: Utilizes advanced laser etching to create abrasion-resistant and corrosion-proof identifiers, ensuring full lifecycle traceability.
• 3-in-1 Integrated Architecture: Combines marking, inspection, and taping into a single footprint, reducing floor space requirements and cutting labor costs.
• Non-Destructive Handling: High-precision vacuum nozzles and non-contact laser processing protect fragile semiconductor substrates and delicate leads from mechanical stress.
• Rapid Changeover: Modular tooling and “one-key” software recipe recalls significantly minimize downtime when switching between different package sizes.
• Industry 4.0 Ready: Full MES integration for real-time data uploading, inspection reporting, and OEE (Overall Equipment Effectiveness) analysis.

Applications

• Semiconductor OSAT: For the final marking and packaging of ICs, diodes, transistors, and power MOSFETs.
• Passive Component Manufacturing: Optimized for high-volume production of chip resistors, capacitors, inductors, and ferrite beads.
• Optoelectronics: Dedicated polarity screening, marking, and taping for LED packaging.
• Precision Electronics: Serving suppliers of connectors, relays, sensors, and automotive-grade electronic components with rigorous quality standards.

Supported Package Types

• Standard Packages: SOP, QFN, BGA, DFN, SOT, TO series, and more.
• Custom SMDs: Any Surface Mount Devices requiring high-precision surface marking, quality screening, and carrier tape packaging.