Automatic Tube to Tape Machine

Ideal for electronics manufacturers and packaging facilities requiring stable and repeatable tube-to-tape transfer:

• OSAT and semiconductor test facilities
• EMS and PCB-A manufacturing plants
• R&D laboratories and pilot production lines
• Automotive, medical, and other regulated electronics applications

Efficient Tube-to-Tape Automation: Automates the complete tube-to-tape process, reducing manual intervention and improving overall production efficiency in IC tape and reel packaging lines.

Wide Package Compatibility: Supports tube-packed IC devices in SOP, TSSOP, MSOP, and similar package types, making it suitable for mixed-product production.

High-Capacity Tube Feeding System: Equipped with a tube stacking magazine and automatic tube feeding, pushing, and inversion mechanisms. More than 40 tubes can be loaded at once, enabling continuous operation and minimizing downtime.

Gentle IC Handling Design: The gravity-fed rail transport system minimizes mechanical stress, protecting sensitive IC devices during transfer and ensuring high packaging yield.

Flexible Taping Parameters: Allows programmable lead and trailing empty pockets, precise taping count control, adjustable carrier tape width, and independent sealing temperature and pressure settings for optimal tape & reel quality.

Intuitive HMI Operation: An industrial touchscreen HMI provides a user-friendly interface with clear parameter settings, fast changeover, and a short operator learning curve.

Customizable Marking Integration: As an optional feature, the marking module offers tailored configurations to suit varied operational demands, ensuring a more versatile and cost-effective equipment investment.