Automatic Tube to Tray Machine

Operation Workflow

Engineered with advanced mechatronics, the KST-TTR30 transforms ICs from a linear sequence into a precise matrix arrangement:

• Automatic Loading: Full IC tubes are loaded into the feeding magazine, where an automated mechanism guides the components onto the transport track.
• Precision Indexing: ICs are aligned and secured at a high-precision stop position at the track’s end for consistent pickup.
• Pick-and-Place: A robotic arm, powered by precision servo motors and vacuum nozzles, executes the transfer from track to tray.
• Vision Alignment (Optional): An integrated CCD vision system performs real-time inspection of orientation, lead integrity, and markings, automatically correcting placement angles or rejecting out-of-spec units.
• Matrix Tray Loading: Components are placed into JEDEC trays according to pre-programmed grid coordinates.

Key Features

• Supports continuous multi-tube feeding and automatic tray stacking, enabling extended periods of unmanned operation.
• Delivers a UPH (Units Per Hour) of 8,000 to 15,000, depending on IC dimensions and operational speed.
• Versatile enough to handle various package types, including SOP, TSSOP, QFP, QFN, BGA, DFN, and more.
• Features a full ESD-safe design and flexible pick-and-place mechanisms to ensure zero damage to IC leads and bodies during the transfer process.
• The integrated vision system automatically identifies and corrects IC orientation, significantly improving packaging accuracy and product quality.

Target Applications

• IC Distribution & Trading: Converting tube-based stock into tray-packaged units for SMT-ready delivery.
• Post-Test/Post-Programming: Efficiently sorting and packaging ICs after they have been programmed or tested in tube format.
• Process Modernization: Upgrading legacy tube-packaged components (e.g., DIP, large SOP) to tray format to improve downstream production efficiency.